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 MST
Features
* * * Apply For LCD Display,Indicators,Illuminations, etc. Compatible With Automatic Placement Equipment Compatible With Reflow Solder Process
MC-SP110DBW
Conventional type
Single Color Surface Mounted Chip LED Size :0805
Maximum Ratings
* * * * * * Operating Temperature: -30 to +80 Storage Temperature: -40 to +85 78 mWatt DC Power Dissipation Reverse Voltage:5.0V Forward Current:30 mA Peak Forward Current:100**mA(IF) ** Pulse test: Pulse width 0.1msec, Duty cycle 10%
Figure 1 Luminous Intensity VS .Forward Current 1000
DIM A B C D E F G H J K
100
10
DIMENSIONS INCHES MM MIN MAX MIN MAX 0.021 0.029 0.525 0.725 0.045 0.053 1.15 1.35 0.075 0.083 1.9 2.1 0.045 0.053 1.15 1.35 0.051 0.059 1.3 1.5 0.008 0.016 0.2 0.4 0.016 0.024 0.4 0.6 0.039 0.047 1.0 1.2 0.012 0.020 0.3 0.5 0.043 0.051 1.1 1.3
NOTE
L
I
SUGGESTED SOLDER PAD LAYOUT
0.035"
1 10
10 10 Forward Current IF (mA)
10
0.047" 0.047"
Revision: 1
2005/10/21
MST
MC-SP110DBW
ELECTRICAL CHARACTERISTICS @25C
LIGHTING COLOR MATERI AL VF(V) TYPE
3.5
(nm) p
-------
MCC PART NUMBER
MC-SP110DBW
MAX
4.2
D
VIEW ANGLE
Iv*(mcd) TYP
White
InGaN
X:0.32 110 Y:0.35
190
40
Figure 2 Forward Current Derating Curve
mA
30
20
10
0
20 40 60 O Ambient Temperature TA( C)
80
100
Figure 3 Radiation Diagram
Ta=25 C
Revision: 1
2005/10/25
MC-SP110DBW
Packing and Shipping Spec.
MST
Reel(7 inches)
Zip-lock
Desiccant
Antistatic Bag
Inner Box
Dimension Outside Inside
Outer Box (Carton)
Dimension Outside Inside
Revision: 1
6 PS
06 PS
6 PS
06 PS
Dimension Spec.
5 Reels per Box
10 Boxes per Carton
2005/10/21
Opto-Electronic Division
MC-SP110DBW
MST
Packing Size
Tape Specification: 3000pcs Per Reel
Item Spec. Tolerance
M 8.00 0.20
A B
G 4.00 0.10
L 1.75 0.10
N 3.50 0.05
H 1.50 0.10 0.00
R 1.00 0.10
J
J 4.00 0.05
K 2.00 0.05
P 1.40 0.10
F 2.30 0.10
A 1.10 0.10
B 0.23 0.05
H
K
10 Pitches Cumulative Tolerance On Tape 0.2
Cover Tape
L
N F
M
For Machine Reference Only Including Draft And Radii Concentric Around Dimension `F'
G
P
R (For Components 20mm x 12mm And Larger)
Feed Direction
Revision: 1
2005/10/21


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